Electronic device

ABSTRACT

An electronic device includes a first electronic component including a first main body, a second electronic component including a second main body, a mounting substrate having a mounting surface, and a heat dissipator having an attaching surface. The mounting surface and the attaching surface face each other in the z direction. The first main body and the second main body are disposed between the mounting substrate and the heat dissipator in the z direction and arranged side by side in the x direction. The first main body has a first front surface facing the attaching surface and a first back surface facing the mounting surface. The second main body has a second front surface facing the attaching surface and a second back surface facing the mounting surface. The dimension of the second main body in the z direction is smaller than the dimension of the first main body in the z direction. The first front surface and the second front surface overlap with each other as viewed in the x direction. A gap is provided between the second back surface and the mounting surface.

TECHNICAL FIELD

The present disclosure relates to an electronic device.

BACKGROUND ART

Conventionally, electronic devices called IPM (Intelligent Power Module)are known. Patent Document 1 discloses an example of a conventional IPM.The IPM disclosed in Patent Document 1 includes a plurality ofsemiconductor elements, a control element, a sealing member and aplurality of terminals. Each of the semiconductor elements is a powersemiconductor chip such as an IGBT (Insulated Gate Bipolar Transistor)or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). Thecontrol element is an LSI chip such as a control IC and controls thedriving of the semiconductor elements. The sealing member covers thesemiconductor elements, the control element and the terminals. Thesealing member is made of an insulating resin material such as epoxyresin. Each of the terminals is partially exposed from the sealing resinand supported by the sealing resin. Each terminal is electricallyconnected to one of the semiconductor elements or the control elementinside the sealing resin.

When the IPM is energized, each semiconductor device generates heat.Since such heat may cause unstable operation of the semiconductorelements, improved heat dissipation of the semiconductor elements isdemanded. This is a challenge not solely for IPMs but common to avariety of electronic components.

TECHNICAL REFERENCE Patent Document

Patent Document 1: JP-A-2014-90006

SUMMARY OF THE INVENTION Problems to be Solved by the Invention:

The present disclosure has been conceived under the above-notedcircumstances, and an object of the present disclosure is to provide anelectronic device with improved heat dissipation of an electroniccomponent.

Means for Solving the Problems

An electronic device provided according to the present disclosureincludes: a first electronic component including a first main body and aplurality of first terminals exposed from the first main body; a secondelectronic component including a second main body and a plurality ofsecond terminals exposed from the second main body; a mounting substratehaving a mounting surface on which the first electronic component andthe second electronic component are disposed; and a heat dissipatorhaving an attaching surface to which the first electronic component andthe second electronic component are attached. The mounting surface andthe attaching surface face each other in the thickness direction. Thefirst main body and the second main body are disposed between themounting substrate and the heat dissipator in a thickness direction andarranged side by side in a first direction orthogonal to the thicknessdirection. The first main body has a first front surface facing theattaching surface and a first back surface facing the mounting surface.The second main body has a second front surface facing the attachingsurface and a second back surface facing the mounting surface. Thedimension of the second main body in the thickness direction is smallerthan the dimension of the first main body in the thickness direction.The first front surface and the second front surface overlap with eachother as viewed in the first direction. A gap is provided between thesecond back surface and the mounting surface.

ADVANTAGES OF THE INVENTION

The electronic device according to the present disclosure improves theheat dissipation of the electronic device (first electronic componentand second electronic component).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of an electronic device according to a firstembodiment;

FIG. 2 is a front view of the electronic device according to the firstembodiment;

FIG. 3 is a rear view of the electronic device according to the firstembodiment;

FIG. 4 is a side view (right side view) of the electronic deviceaccording to the first embodiment;

FIG. 5 shows an example of a circuit configuration of a first electroniccomponent;

FIG. 6 shows an example of a circuit configuration of a secondelectronic component;

FIG. 7 is a plan view of an electronic device according to a secondembodiment;

FIG. 8 is a front view of the electronic device according to the secondembodiment;

FIG. 9 is a rear view of the electronic device according to the secondembodiment;

FIG. 10 is a side view (right side view) of the electronic deviceaccording to the second embodiment;

FIG. 11 is a plan view of an electronic device according to a thirdembodiment;

FIG. 12 is a front view of the electronic device according to the thirdembodiment;

FIG. 13 is a rear view of the electronic device according to the thirdembodiment;

FIG. 14 is a side view (right side view) of the electronic deviceaccording to the third embodiment; and

FIG. 15 is a side view (right side view) of an electronic deviceaccording to a fourth embodiment.

MODE FOR CARRYING OUT THE INVENTION

Preferred embodiments of the electronic device according to the presentdisclosure are described below with reference to the accompanyingdrawings.

First Embodiment

FIGS. 1-6 show an electronic device A1 according to a first embodiment.The electronic device A1 includes a first electronic component 1, asecond electronic component 2, a mounting substrate 3, a heat dissipator4, and a plurality of conductive bonding materials 5.

FIG. 1 is a plan view of the electronic device A1. In FIG. 1 , the heatdissipator 4 is shown by an imaginary line (double-dotted line). FIG. 2is a front view of the electronic device A1. FIG. 3 is a rear view ofthe electronic device A1. FIG. 4 is a side view (right side view) of theelectronic device A1. FIG. 5 is an example of a circuit diagram of thefirst electronic component 1. FIG. 6 is an example of a circuit diagramof the second electronic component 2.

For convenience, the three directions that are orthogonal to each otherare defined as x direction, y direction and z direction. The z directionis the thickness direction of the electronic device A1. The x directionis the horizontal direction in the plan view (see FIG. 1 ) of theelectronic device A1. The y direction is the vertical direction in theplan view (see FIG. 1 ) of the electronic device A1. In the descriptionbelow, one sense in the z direction (upper side in FIG. 4 ) may bereferred to as “upward”, and the other sense in the z direction (lowerside in FIG. 4 ) may be referred to as “downward”. Also, in thedescription below, “as viewed in plan” means “as viewed in the zdirection”. The z direction is an example of the “thickness direction”,and the x direction is an example of the “first direction”.

Each of the first electronic component 1 and the second electroniccomponent 2 is an IPM, for example. IPM is an abbreviation forintelligent power module, which incorporates a semiconductor element forpower and a control element for controlling the semiconductor element ina single package. The first electronic component 1 and the secondelectronic component 2 are used, for example, for power control ininverter devices or motor control equipment. The first electroniccomponent 1 and the second electronic component 2 are mounted to themounting substrate 3. The first electronic component 1 and the secondelectronic component 2 are not limited to IPMs, but may be discretecomponents or power modules that do not incorporate control elements.

As shown in FIG. 5 , the first electronic component 1 includes aplurality of first semiconductor elements Q1, a first control elementM1, and a plurality of first terminals T11 and T12. The circuit diagramshown in FIG. 5 is one example, and the circuit diagram may varydepending on the first electronic component 1 used.

Each of the first semiconductor elements Q1 is a power semiconductorchip such as an IGBT, a MOSFET or a diode, for example. In the exampleshown in FIG. 5 , the first electronic component 1 includes four firstsemiconductor elements Q1, and each of the four first semiconductorelements Q1 is constituted by an n-channel MOSFET. Two of the four firstsemiconductor elements Q1 are connected in series to form one leg, andthe remaining two are connected in series to form another leg. In thisway, the first electronic component 1 includes two legs. The connectionof the four first semiconductor elements Q1 is not limited to theexample shown in FIG. 5 . Four example, the four first semiconductorelements Q1 may be connected in a full-bridge, or the four firstsemiconductor elements Q1 may not be connected to each other. The numberof the first semiconductor elements Q1 is not limited to the above-notedexample. For example, the first electronic component 1 may include asingle first semiconductor element Q1 or may include six firstsemiconductor elements Q1 connected in a three-phase bridge.

The first control element M1 is an LSI chip such as a control IC, forexample. The first control element M1 controls the driving of the firstsemiconductor elements Q1. Specifically, the first control element M1inputs a driving signal (e.g., gate voltage) to each of the firstsemiconductor elements Q1 to control the driving (switching operation)of the first semiconductor elements Q1. The first control element M1includes a drive circuit. In the example shown in FIG. 5 , the singlefirst control element M1 controls the driving of the four firstsemiconductor elements Q1, but the present disclosure is not limited tosuch a configuration. For example, the first control element M1 may beprovided for each of the two legs, or the first control element M1 maybe provided for each of the four first semiconductor elements Q1.

The plurality of first terminals T11 and T12 are the external terminalsof the first electronic component 1. As shown in FIG. 5 , the firstterminals T11 are connected to the first semiconductor elements Q1. Thefirst terminals T11 include a pair of input terminals T11 a and T11 b,an output terminal T11 c and a detection terminal T11 d for two firstsemiconductor elements Q1 connected in series. A power supply voltage isapplied to the pair of input terminals T11 a and T11 b. The inputterminal T11 a is a P terminal, and the input terminal T11 b is an Nterminal. The output terminal T11 c outputs a voltage input through thepair of input terminals T11 a and T11 b and converted by the switchingoperation of the two first semiconductor elements Q1 in each leg. Theoutput terminal T11 c is connected to the connection point of the twofirst semiconductor elements Q1 in each leg. The detection terminal T11d is used to detect the output voltage, and is connected to theconnection point of the two first semiconductor elements Q1 in each legvia a shunt resistor R1, for example. The shunt resistors R1 may not beincorporated in the first electronic component 1 but may be disposedoutside the first electronic component 1. As shown in FIG. 5 , the firstterminals T12 are connected to the first control element M1. Theplurality of first terminals T12 include those which receive or outputvarious control signals for controlling the first electronic component 1and those which receive the operating voltage of the first controlelement M1.

As shown in FIGS. 1-4 , the first electronic component 1 is configuredas a module including a first main body 10 and a plurality of firstterminals 15.

The first main body 10 includes the first semiconductor elements Q1, thefirst control element M1, a first sealing member 11 and a first supportsubstrate 12.

The first sealing member 11 is a package that covers the firstsemiconductor elements Q1 and the first control element M1 to protectthese from light, heat, moisture, dust and physical shock, for example.The first sealing member 11 is made of an insulating resin material, forexample. An example of such a resin material is epoxy resin. As shown inFIG. 1 , the first sealing member 11 may be rectangular as viewed inplan.

As shown in FIGS. 1-4 , the first sealing member 11 has a front surface111, a back surface 112 and a plurality of side surfaces 113 and 114.The front surface 111 and the back surface 112 are spaced apart fromeach other in the z direction and face away from each other in the zdirection. In the z direction, the front surface 111 faces the heatdissipator 4, and the back surface 112 faces the mounting substrate 3.The front surface 111 and the back surface 112 are both flat. Each ofthe side surfaces 113 and 114 is located between the front surface 111and the back surface 112 in the z direction and connected to the frontsurface 111 and the back surface 112. The two side surfaces 113 arespaced apart from each other in the x direction and face away from eachother in the x direction. The two side surfaces 114 are spaced apartfrom each other in the y direction and face away from each other in they direction. The front surface 111 is an example of the “first sealingsurface”.

Inside the first sealing member 11, the first support substrate 12supports at least the first semiconductor elements Q1. At least a partof the first support substrate 12 is covered with the first sealingmember 11. The first support substrate 12 is provided to quicklydissipate the heat generated in the first semiconductor elements Q1 tothe outside of the first electronic component 1. The first supportsubstrate 12 is made of a material with excellent thermal conductivity(e.g., a ceramic material), but is not limited to this. The higher thethermal conductivity of the material for the first support substrate 12is, the better. However, if the coefficient of thermal expansion of thematerial for the first support substrate differs greatly from that ofthe material for the first sealing member 11, problems such asdetachment of the first support substrate 12 and the first sealingmember 11 may occur. Thus, for the first support substrate 12, it ispreferable to use a material with a thermal conductivity higher thanthat of the material for the first sealing member 11 and a coefficientof thermal expansion close to that of the material for the first sealingmember 11. The first main body 10 may not include the first supportsubstrate 12.

As shown in FIGS. 2-4 , the first support substrate 12 has a firstexposed surface 121 and a first support surface 122 spaced apart fromeach other in the z direction. The first exposed surface 121 and thefirst support surface 122 are both flat. The first exposed surface 121faces (upward) in the z direction and faces the heat dissipator 4(attaching surface 41 described later). The first exposed surface 121 isexposed from the front surface 111 of the first sealing member 11. Asshown in FIG. 1 , the front surface 111 is shaped like a framesurrounding the first exposed surface 121, as viewed in plan. The firstexposed surface 121 is flush (or approximately flush, which holds truehereinafter) with the front surface 111 in the example shown in FIGS.2-4 , but may be located above the front surface 111. The first supportsubstrate 12 may not have the first exposed surface 121. That is, thefirst support substrate 12 may be completely covered with the firstsealing member 11. The first support surface 122 faces (downward) in thez direction and faces the mounting substrate 3 (mounting surface 31described later). The first semiconductor elements Q1 are mounted on thefirst support surface 122.

The first main body 10 has a first front surface and a first backsurface. The first front surface is the uppermost surface of the firstmain body 10 and faces the heat dissipator 4 (attaching surface 41described later). In the present embodiment, the first front surface isconstituted by the front surface 111 (first sealing member 11) and thefirst exposed surface 121 (first support substrate 12). In aconfiguration different from the present embodiment, when the firstsupport substrate 12 is not exposed from the first sealing member 11 orthe first main body 10 does not include the first support substrate 12,the first front surface is constituted by the front surface 111 (firstsealing member 11). When the first exposed surface 121 is located abovethe front surface 111, the first front surface is constituted by thefirst exposed surface 121. The first back surface is the lowermostsurface of the first main body 10 and faces the mounting substrate 3(mounting surface 31 described later). In the present embodiment, thefirst back surface is constituted by the back surface 112 (first sealingmember 11).

Each of the first terminals 15 is partially covered with the firstsealing member 11 and partially exposed from the first sealing member11. Inside the first sealing member 11, the first terminals 15 areelectrically connected to the first semiconductor elements Q1 or thefirst control element M1. The first terminals 15 correspond to the firstterminals T11 or T12 in the circuit configuration (see FIG. 5 ) of thefirst electronic component 1.

The material for the first terminals 15 is not limited, and copper (Cu),aluminum, iron (Fe), oxygen-free copper, or their alloys (e.g., Cu-Snalloy, Cu-Zr alloy or Cu-Fe alloy) may be used. Each of the firstterminals 15 may be plated with nickel (Ni).

As shown in FIGS. 1-3 , each of the first terminals 15 projects from oneof the two side surfaces 114. Unlike this, each of the first terminals15 may project from one of the two side surfaces 113. Each of the firstterminals 15 may project from the back surface 112. The first terminals15 are configured as the insertion mount type. Each of the firstterminals 15 is partially bent and includes a portion extending alongthe y direction from one of the two side surfaces 114 and a portionextending along the z direction.

The first terminals 15 include a plurality of first power terminals 151and a plurality of first control terminals 152. The first powerterminals 151 are electrically connected to the first semiconductorelements Q1 inside the first sealing member 11. The first powerterminals 151 correspond to the first terminals T11 in the circuitconfiguration (see FIG. 5 ) of the first electronic component 1. Thefirst control terminals 152 are electrically connected to the firstcontrol element M1 inside the first sealing member 11. The first controlterminals 152 correspond to the first terminals T12 in the circuitconfiguration (see FIG. 5 ) of the first electronic component 1.

As shown in FIG. 6 , the second electronic component 2 includes aplurality of second semiconductor elements Q2, a second control elementM2, and a plurality of second terminals T21 and T22. The circuit diagramshown in FIG. 6 is one example, and the circuit diagram may vary asappropriate depending on the second electronic component 2 used.

Each of the second semiconductor elements Q2 is a power semiconductorchip such as an IGBT, a MOSFET or a diode. The number of the secondsemiconductor elements Q2 is smaller than that of the firstsemiconductor elements Q1. In the example shown in FIG. 6 , the secondelectronic component 2 includes two second semiconductor elements Q2,and each of the two second semiconductor elements Q2 is constituted byan n-channel MOSFET. The two semiconductor elements Q2 are connected inseries to form a leg. The connection of the two second semiconductorelements Q2 is not limited to the example shown in FIG. 6 . Fourexample, the two semiconductor elements Q2 may not be connected to eachother. The number of the two semiconductor elements Q2 is not limited tothe above-noted example. For example, the second electronic component 2may include a single second semiconductor element Q2, four secondsemiconductor elements Q2 connected in a full-bridge, or six secondsemiconductor elements Q2 connected in a three-phase bridge.

The second control element M2 is an LSI chip such as a control IC, forexample. The second control element M2 controls the driving of thesecond semiconductor elements Q2. Specifically, the second controlelement M2 inputs a driving signal (e.g., gate voltage) to each of thesecond semiconductor elements Q2 to control the driving (switchingoperation) of the second semiconductor elements Q2. The second controlelement M2 includes a drive circuit. In the example shown in FIG. 6 ,the single second control element M2 controls the driving of the twosecond semiconductor elements Q2, but the present disclosure is notlimited to such a configuration. For example, the second control elementM2 may be provided for each of the two semiconductor elements Q2.

The plurality of second terminals T21 and T22 are the external terminalsof the second electronic component 2. As shown in FIG. 6 , the secondterminals T21 are connected to the second semiconductor elements Q2. Thesecond terminals T21 include a pair of input terminals T21 a and T21 b,an output terminal T21 c and a detection terminal T21 d. A power supplyvoltage is applied to the pair of input terminals T21 a and T21 b. Theinput terminal T21 a is a P terminal, and the input terminal T21 b is anN terminal. The output terminal T21 c outputs a voltage input throughthe pair of input terminals T21 a and T21 b and converted by theswitching operation of the two second semiconductor elements Q2. Theoutput terminal T21 c is connected to the connection point of the twosecond semiconductor elements Q2. The detection terminal T21 d is usedto detect the output voltage, and is connected to the connection pointof the two second semiconductor elements Q2 via a shunt resistor R2, forexample. The shunt resistor R2 may not be incorporated in the secondelectronic component 2 but may be disposed outside the second electroniccomponent 2. As shown in FIG. 6 , the second terminals T22 are connectedto the second control element M2. The plurality of second terminals T22include those which receive or output various control signals forcontrolling the second electronic component 2 and those which receivethe operating voltage of the second control element M2.

As shown in FIGS. 1-4 , the second electronic component 2 is configuredas a module including a second main body 20 and a plurality of secondterminals 25.

The second main body 20 includes the second semiconductor elements Q2,the second control element M2, a second sealing member 21 and a secondsupport substrate 22.

The second sealing member 21 is a package that covers the secondsemiconductor elements Q2 and the second control element M2 to protectthese from light, heat, moisture, dust and physical shock, for example.The second sealing member 21 is made of an insulating resin material,for example. An example of such a resin material is epoxy resin. Asshown in FIG. 1 , the second sealing member 21 may be rectangular asviewed in plan.

As shown in FIGS. 1-4 , the second sealing member 21 has a front surface211, a back surface 212 and a plurality of side surfaces 213 and 214.The front surface 211 and the back surface 212 are spaced apart fromeach other in the z direction and face away from each other in the zdirection. In the z direction, the front surface 211 faces the heatdissipator 4, and the back surface 212 faces the mounting substrate 3.The front surface 211 and the back surface 212 are both flat. The frontsurface 211 is in a same x-y plane (plane orthogonal to the z direction)as the front surface 111 (first sealing member 11). Each of the sidesurfaces 213 and 214 is located between the front surface 211 and theback surface 212 in the z direction and connected to the front surface211 and the back surface 212. The two side surfaces 213 are spaced apartfrom each other in the x direction and face away from each other in thex direction. The two side surfaces 214 are spaced apart from each otherin the y direction and face away from each other in the y direction. Thefront surface 211 is an example of the “second sealing surface”.

Inside the second sealing member 21, the second support substrate 22supports at least the second semiconductor elements Q2. At least a partof the second support substrate 22 is covered with the second sealingmember 21. The second support substrate 22 is provided to quicklydissipate the heat generated in the second semiconductor elements Q2 tothe outside of the second electronic component 2. The second supportsubstrate 22 is made of a material with excellent thermal conductivity(e.g., a ceramic material), but is not limited to this. The higher thethermal conductivity of the material for the second support substrate 22is, the better. However, if the coefficient of thermal expansion of thematerial for the second support substrate differs greatly from that ofthe material for the second sealing member 21, problems such asdetachment of the second support substrate 22 and the second sealingmember 21 may occur. Thus, for the second support substrate 22, it ispreferable to use a material with a thermal conductivity higher thanthat of the material for the second sealing member 21 and a coefficientof thermal expansion close to that of the material for the secondsealing member 21. The second main body 20 may not include the secondsupport substrate 22.

As shown in FIGS. 2-4 , the second support substrate 22 has a secondexposed surface 221 and a second support surface 222 spaced apart fromeach other in the z direction. The second exposed surface 221 and thesecond support surface 222 are both flat. The second exposed surface 221faces upward in the z direction and faces the heat dissipator 4(attaching surface 41 described later). The second exposed surface 221is exposed from the front surface 211 of the second sealing member 21.As shown in FIG. 1 , the front surface 211 is shaped like a framesurrounding the second exposed surface 221, as viewed in plan. Thesecond exposed surface 221 is flush with the front surface 211 in theexample shown in FIGS. 2-4 , but may be located above the front surface211. The second support substrate 22 may not have the second exposedsurface 221. That is, the second support substrate 22 may be completelycovered with the second sealing member 21. The second support surface222 faces downward and faces the mounting substrate 3 (mounting surface31 described later). The second semiconductor elements Q2 are mounted onthe second support surface 222.

The second main body 20 has a second front surface and a second backsurface. The second front surface is the uppermost surface of the secondmain body 20 and faces the heat dissipator 4 (attaching surface 41described later). In the present embodiment, the second front surface isconstituted by the front surface 211 (second sealing member 21) and thesecond exposed surface 221 (second support substrate 22). In aconfiguration different from the present embodiment, when the secondsupport substrate 22 is not exposed from the second sealing member 21 orthe second main body 20 does not include the second support substrate22, the second front surface is constituted by the front surface 211(second sealing member 21). When the second exposed surface 221 islocated above the front surface 211, the second front surface isconstituted by the second exposed surface 221. The second back surfaceis the lowermost surface of the second main body 20 and faces themounting substrate 3 (mounting surface 31 described later). In thepresent embodiment, the second back surface is constituted by the backsurface 212 (second sealing member 21).

Each of the second terminals 25 is partially covered with the secondsealing member 21 and partially exposed from the second sealing member21. Inside the second sealing member 21, the second terminals 25 areelectrically connected to the second semiconductor elements Q2 or thesecond control element M2. The second terminals 25 correspond to thesecond terminals T21 or T22 in the circuit configuration (see FIG. 6 ).

The material for the second terminals 25 is not limited, and copper(Cu), aluminum, iron (Fe), oxygen-free copper, or their alloys (e.g.,Cu-Sn alloy, Cu-Zr alloy or Cu-Fe alloy) may be used. Each of the secondterminals 25 may be plated with nickel (Ni).

As shown in FIGS. 1-3 , each of the second terminals 25 projects fromone of the two side surfaces 214. Unlike this, each of the secondterminals 25 may project from one of the two side surfaces 213. Each ofthe second terminals 25 may project from the back surface 212. Thesecond terminals 25 are configured as the insertion mount type. Each ofthe second terminals 25 is partially bent and includes a portionextending along the y direction from one of the two side surfaces 214and a portion extending along the z direction.

The second terminals 25 include a plurality of second power terminals251 and a plurality of second control terminals 252. The second powerterminals 251 are electrically connected to the second semiconductorelements Q2 inside the second sealing member 21. The second powerterminals 251 correspond to the second terminals T21 in the circuitconfiguration (see FIG. 6 ) of the second electronic component 2. Thesecond control terminals 252 are electrically connected to the secondcontrol element M2 inside the second sealing member 21. The secondcontrol terminals 252 correspond to the second terminals T22 in thecircuit configuration (see FIG. 6 ) of the second electronic component2.

As shown in FIGS. 1-3 , of the plurality of second terminals 25, thesecond terminals 25 disposed near the four corners as viewed in plan areeach formed with a second projection 253. As shown in FIGS. 1-3 , ineach of these second terminals 25, the second projection 253 projects inthe x direction. Note that the second projections 253 are not limited tothose projecting in the x direction and may project in any directionorthogonal to the z direction. As shown in FIGS. 2 and 3 , the secondprojections 253 are provided between the back surface 212 and themounting substrate 3 (mounting surface 31 described later). The secondprojection 253 may be formed on one or more of the second terminals 25and may be formed on all second terminals 25, for example.Alternatively, no second terminals 25 may be formed with the secondprojection 253. However, to stabilize the posture of the secondelectronic component 2, it is desirable that at least the secondterminals 25 disposed near the four corners as viewed in plan areprovided with the second projections 253.

The first electronic component 1 and the second electronic component 2are mounted to the mounting substrate 3. The mounting substrate 3 is acircuit board used for electronic equipment, for example. The mountingsubstrate 3 is made of an insulating material and may be a PCB. Themounting substrate 3 is formed with an interconnect pattern (not shown).The first terminals 15 of the first electronic component 1 and thesecond terminals 25 of the second electronic component 2 areelectrically connected to the interconnect pattern formed on themounting substrate 3.

The mounting substrate 3 has a mounting surface 31 facing one sense ofthe z direction (upward). The mounting surface 31 is flat. The mountingsurface 31 faces the first electronic component 1 and the secondelectronic component 2. The first electronic component 1 and the secondelectronic component 2 are disposed on the mounting surface 31. As shownin FIGS. 2-4 , the back surface 112 of the first sealing member 11 is incontact with the mounting surface 31, whereas the back surface 212 ofthe second sealing member 21 is spaced apart from the mounting surface31. In the illustrated example, the first electronic component 1 and thesecond electronic component 2 are arranged side by side in the xdirection, but the present disclosure is not limited to this. Forexample, the first electronic component 1 and the second electroniccomponent 2 may be arranged side by side in a direction different fromthe x direction on the mounting surface 31.

As shown in FIGS. 1-4 , the mounting substrate 3 is formed with aplurality of through-holes 33. Each of the through-holes 33 penetratesthe mounting substrate 3 in the z direction. In each through-hole 3, oneof the first terminals 15 of the first electronic component 1 or one ofthe second terminals 25 of the second electronic component is inserted.In FIG. 2 , the through-holes 33 in which the first power terminals 151of the first terminals 15 or the second power terminals 251 of thesecond terminals 25 are inserted are shown by hidden lines (brokenlines).

In FIG. 3 , the through-holes 33 in which the first control terminals152 of the first terminals 15 or the second control terminal 252 of thesecond terminals 25 are inserted are shown by hidden lines (brokenlines).

As shown in FIGS. 2 and 3 , when the second terminals 25 are inserted inthe through-holes 33, the respective lower edges of the secondprojections 253 are in contact with the mounting surface 31.Specifically, each of the second projections 253 is caught on themounting substrate 3, so that the second electronic component 2 ismounted to the mounting substrate 3 with a gap formed between the backsurface 212 of the second sealing member 21 and the mounting surface 31.

The heat dissipator 4 is made of a material with a relatively highthermal conductivity, which may be a metal such as aluminum. The heatdissipator 4 is attached to the first electronic component 1 and thesecond electronic component 2. For example, the heat dissipator 4 isbonded to the first front surface of the first main body 10 (the frontsurface 111 of the first sealing member 11 and the first exposed surface121 of the first support substrate 12) and to the second front surfaceof the second main body 20 (the front surface 211 of the second sealingmember 21 and the second exposed surface 221 of the second supportsubstrate 22) with an adhesive (not shown). The heat dissipator 4 may befixed to the mounting substrate 3 with a fixture (not shown). In such acase, the heat dissipator 4 may not be bonded to the first front surfaceof the first main body 10 or the second front surface of the second mainbody 20 but may only be held in direct contact with these surfaces.

The heat dissipator 4 has an attaching surface 41 facing one sense ofthe z direction (downward). The attaching surface 41 is flat. Theattaching surface 41 faces the first electronic component 1 and thesecond electronic component 2. The first electronic component 1 and thesecond electronic component 2 are attached to the attaching surface 41.As shown in FIGS. 2-4 , the attaching surface 41 is in contact with thefront surface 111 of the first sealing member 11 and the front surface211 of the second sealing member 21. An adhesive or a heat conductivesheet may be interposed between the attaching surface 41 and the frontsurface 111 or the front surface 211. The upper side (opposite theattaching surface 41 in the z direction) of the heat dissipator 4 isformed with a so-called fin provided with a number of pins like a kenzan(flower frog) or with plates like a bellows.

As shown in FIGS. 2-4 , the conductive bonding materials 5 are formed onthe surface of the mounting substrate 3 that faces away from themounting surface 31 in the z direction. The conductive bonding materials5 bond the first electronic component 1 and the second electroniccomponent 2 to the mounting substrate 3 while electrically connectingthe first terminals 15 of the first electronic component 1 and thesecond terminals 25 of the second electronic component 2 to theinterconnect pattern of the mounting substrate 3. The material for theconductive bonding materials 5 is not limited, and solder may be used,for example.

In the electronic device A1, the dimension of the first main body 10(first sealing member 11) in the z direction and the dimension of thesecond main body 20 (second sealing member 21) in the z direction differfrom each other. In the electronic device A1, the dimension of thesecond main body 20 in the z direction is smaller than the dimension ofthe first main body 10 in the z direction, because the number of thesecond semiconductor elements Q2 incorporated in the second electroniccomponent 2 is smaller than the number of the first semiconductorelements Q1 incorporated in the first electronic component 1. The causeof the difference between the dimension of the first main body 10 in thez direction and the dimension of the second main body 20 in the zdirection is not limited to the difference between the number of thefirst semiconductor elements Q1 and the number of the secondsemiconductor elements Q2. For example, different packaging standardsmay be adopted for the first electronic component 1 and the secondelectronic component 2, which may result in the difference between thedimension of the first main body 10 in the z direction and that of thesecond main body 20. Also, the first semiconductor elements Q1 and thesecond semiconductor elements Q2, which are used in the first electroniccomponent 1 and the second electronic component 2, respectively, maydiffer in size from each other, which may result in the differencebetween the dimension of the first main body 10 in the z direction andthat of the second main body 20.

As shown in FIGS. 2-4 , in the electronic device A1, the first backsurface of the first main body 10 (back surface 112 of the first sealingmember 11) is in contact with the mounting surface 31, whereas a gapexists between the second back surface of the second main body 20 (backsurface 212 of the second sealing member 21) and the mounting surface31. Thus, the separation distance T2 between the back surface 212 andthe mounting surface 31 in the z direction is larger than the separationdistance T1 between the back surface 112 and the mounting surface 31 inthe z direction (T1=0 in the illustrated example). The separationdistance T2 is set appropriately in accordance with the differencebetween the dimension of the first sealing member 11 in the z directionand the dimension of the second sealing member 21 in the z direction.Specifically, the separation distance T2 is set such that the difference(T2-T1) between the separation distance T2 and the separation distanceT1 corresponds to the difference between the dimension of the first mainbody 10 in the z direction and the dimension of the second main body 20in the z direction.

The advantages of the electronic device A1 according to the firstembodiment are as follows.

The electronic device A1 includes the heat dissipator 4 attached to thefirst electronic component 1 and the second electronic component 2.Thus, even when the first electronic component 1 and the secondelectronic component 2 generate heat during the energization of theelectronic device A1, such heat is dissipated through the heatdissipator 4. In this way, the electronic device A1 enhances the heatdissipation from the first electronic component 1 and the secondelectronic component 2.

In the electronic device A1, a gap is provided between the second backsurface of the second main body 20 (back surface 212 of the secondsealing member 21) and the mounting surface 31 (mounting substrate 3).Such an arrangement makes it possible to arrange the first front surfaceof the first main body 10 (front surface 111 and first exposed surface121) and the second front surface of the second main body 20 (frontsurface 211 and second exposed surface 221) within a same x-y plane whenthe dimension of the second main body 20 in the z direction is smallerthan the dimension of the first main body 10 in the z direction. Inother words, the first front surface of the first main body 10 and thesecond front surface of the second main body 20 can be made overlap witheach other as viewed in the x direction. Unlike the illustrated example,when no gap is provided between the second back surface of the secondmain body 20 and the mounting surface 31, the difference between thedimension of the first main body 10 in the z direction and the dimensionof the second main body 20 in the z direction results in a step beingformed between the first front surface and the second front surface. Insuch a case, the heat dissipator 4 common to the first electroniccomponent 1 and the second electronic component 2 cannot be provided,and a heat dissipator needs to be provided separately for eachelectronic component. This complicates the manufacture and maintenanceof the electronic device. The electronic device Al eliminates such astep between the first front surface of the first main body 10 and thesecond front surface of the second main body 20 to allow the attachmentof the heat dissipator 4 common to the first electronic component 1 andthe second electronic component 2, which simplifies manufacture andmaintenance.

In the example shown in FIGS. 1-4 , the first main body 10 is largerthan the second main body 20 in dimension in the z direction and also insize as viewed in plan. Thus, in the present embodiment, the firstelectronic component 1 is heavier than the second electronic component2. In the electronic device A1, the main body of the first electroniccomponent 1 is directly supported by the mounting substrate 3, with nogap provided between the first back surface of the first main body 10(back surface 112 of the first sealing member 11) and the mountingsurface 31 (mounting substrate 3) , and with the first back surface ofthe first main body 10 held into contact with the mounting surface 31.This is effective in preventing the first terminals 15 of the firstelectronic component 1 from bending.

In the electronic device A1, selected ones of the second terminals 25(second electronic component 2) are each formed with a second projection253. With such a configuration, each of the second projections 253engages with the mounting surface 31 to prevent the second main body 20from approaching the mounting substrate 3 across the predeterminedseparation distance. That is, the separation distance T2 is reliablymaintained between the second back surface of the second main body 20(back surface 212 of second sealing member 21) and the mounting surface31.

Second Embodiment

FIGS. 7-10 show an electronic device A2 according to a secondembodiment. FIG. 7 is a plan view of the electronic device A2, in whichthe heat dissipator 4 is shown by an imaginary line. FIG. 8 is a frontview of the electronic device A2. FIG. 9 is a rear view of theelectronic device A2. FIG. 10 is a side view (right side view) of theelectronic device A2.

As shown in FIGS. 7-10 , the electronic device A2 differs from theelectronic device A1 in that a gap is provided also between the firstback surface of the first main body 10 (back surface 112 of the firstsealing member 11) and the mounting surface 31 (mounting substrate 3).

As mentioned above, the electronic device A2 has a gap between the backsurface 112 and the mounting surface 31, as shown in FIGS. 8-10 . Thatis, in the electronic device A2, the separation distance T1 between theback surface 112 and the mounting surface 31 is made larger than theseparation distance T1 in the first embodiment. Thus, the separationdistance T2 between the back surface 212 and the mounting surface 31 ismade larger than the separation distance T2 in the first embodiment bythe amount of the increased separation distance T1. In the presentembodiment again, the separation distance T2 between the back surface212 and the mounting surface 31 is larger than the separation distanceT1 between the back surface 112 and the mounting surface 31.

In the electronic device A2, the first terminals 15 disposed near thefour corners as viewed in plan are each formed with a first projection153. As shown in FIGS. 7-9 , in each of these first terminals 15, thefirst projection 153 projects in the x direction. Note that the firstprojections 153 are not limited to those projecting in the x directionand may project in any direction orthogonal to the z direction. Thefirst projections 153 have the same shape as the second projections 253.As shown in FIGS. 7-9 , the first projections 153 are disposed betweenthe back surface 112 and the mounting surface 31. The first projection153 may be formed on one or more of the first terminals 15 and may beformed on all first terminals 15, for example. Alternatively, no firstterminals 15 may be formed with the first projection 153. However, tostabilize the posture of the first electronic component 1, it isdesirable that at least the first terminals 15 disposed near the fourcorners as viewed in plan are provided with the first projections 153.

As shown in FIGS. 8 and 9 , when the first terminals 15 are inserted inthe through-holes 33, the respective lower edges of the firstprojections 153 are in contact with the mounting surface 31.Specifically, each of the first projections 153 is caught on themounting substrate 3, so that the first electronic component 1 ismounted to the mounting substrate 3 with a gap formed between the backsurface 112 of the first sealing member 11 and the mounting surface 31.

As with the electronic device A1, the electronic device A2 includes theheat dissipator 4 attached to the first electronic component 1 and thesecond electronic component 2. Thus, the electronic device A2 enhancesthe heat dissipation from the first electronic component 1 and thesecond electronic component 2. The electronic device A1 also eliminatesa step between the first front surface of the first main body 10 (mainlythe front surface 111 of the first sealing member 11) and the secondfront surface of the second main body 20 (mainly the front surface 211of the second sealing member 21) to allow the attachment of the heatdissipator 4 common to the first electronic component 1 and the secondelectronic component 2. Thus, the manufacture and maintenance of thedevice is relatively easy.

In the electronic device A2, selected ones of the first terminals 15(first electronic component 1) are each formed with a first projection153. With such an arrangement, each of the first projections 153 engageswith the mounting surface 31 to prevent the first main body 10 fromfurther approaching the mounting substrate 3. That is, the separationdistance T1 is reliably maintained between the first back surface of thefirst main body 10 (back surface 112 of first sealing member 11) and themounting surface 31.

In the first embodiment and the second embodiment, the shape of eachfirst projection 153 and each second projection 253 is not limited tothe above example, and may be any shape that does not pass through thethrough-holes 33 but is caught on the mounting surface 31. Also,selected ones of the first terminals 15 each may be relatively thick ata portion above the mounting surface 31 in the z direction andrelatively thin at a portion below the mounting surface 31 in the zdirection, rather than being formed with a first projection 153. In sucha case, the diameter of the relatively thick portion is made larger thanthe diameter of the through-holes 33. With such an arrangement, thethick portions of these first terminals 15 are caught on the mountingsurface 31, so that the separation distance T1 is reliably secured.Similarly, selected ones of the second terminals 25 each may also berelatively thick at a portion above the mounting surface 31 in the zdirection and relatively thin at a portion below the mounting surface 31in the z direction, rather than being formed with a second projection253. In such a case, the diameter of the relatively thick portion ismade larger than the diameter of the through-holes 33. With such anarrangement, the thick portions of these second terminals 25 are caughton the mounting surface 31, so that the separation distance T2 isreliably secured.

Third Embodiment

FIGS. 11-14 show an electronic device A3 according to a thirdembodiment. FIG. 11 is a plan view of the electronic device A3. FIG. 12is a plan view of the electronic device A3. FIG. 13 is a rear view ofthe electronic device A3. FIG. 14 is a side view (right side view) ofthe electronic device A3.

As shown in FIGS. 11-14 , the electronic device A3 differs from theelectronic device A1 in that the first terminals 15 of the firstelectronic component 1 and the second terminals 25 of the secondelectronic component 2 are configured as the surface mount type.

In the mounting substrate 3 of the electronic device A3, theinterconnect pattern (now shown) includes a plurality of land patterns34. The land patterns 34 are electrically connected by the interconnectpattern (not shown).

As mentioned above, each of the first terminals 15 and each of thesecond terminals 25 is configured as the surface mount type. The firstterminals 15 and the second terminals 25 are, for example, in the formof a strip as viewed in plan.

As shown in FIG. 14 , each of the first terminals 15 is partially bentto include a base portion extending from a side surface 114 along the ydirection, an intermediate portion extending downward in the zdirection, and an end portion extending along the y direction. The endportion (distal end from each side surface 114) is bonded to a relevantland pattern 34. In the illustrated example, each first terminal 15 anda relevant land pattern 34 are bonded with a conductive bonding material5 (e.g., solder). In the example shown in FIG. 14 , the intermediateportion is inclined with respect to the z direction. However, theintermediate portion may be along the z direction.

As shown in FIG. 14 , each of the second terminals 25 is also partiallybent to include a base portion extending from a side surface 214 alongthe y direction, an intermediate portion extending downward in the zdirection, and an end portion extending along the y direction. The endportion (distal end from each side surface 214) is bonded to a relevantland pattern 34. In the illustrated example, each second terminal 25 anda relevant land pattern 34 are bonded with a conductive bonding material5 (e.g., solder). In the example shown in FIG. 14 , the intermediateportion is inclined with respect to the z direction. However, theintermediate portion may be along the z direction.

In the electronic device A3, the dimension of each second terminal 25 inthe z direction is made larger than the dimension of each first terminal15 in the z direction. Specifically, the dimension of the intermediateportion of each second terminal 25 in the z direction is made largerthan the dimension of the intermediate portion of each first terminal 15in the z direction. Such an arrangement makes the separation distance T2between the back surface 212 and the mounting surface 31 in the zdirection larger than the separation distance T1 between the backsurface 112 and the mounting surface 31 in the z direction, allowing thefront surface 111 (first sealing member 11) and the front surface 211(second sealing member 21) to be positioned within a same x-y plane.

As with the electronic devices A1 and A2, the electronic device A3includes the heat dissipator 4 attached to the first electroniccomponent 1 and the second electronic component 2. Thus, the electronicdevice A3 enhances the heat dissipation from the first electroniccomponent 1 and the second electronic component 2. The electronic deviceA3 also eliminates a step between the first front surface of the firstmain body 10 (mainly the front surface 111 of the first sealing member11) and the second front surface of the second main body 20 (mainly thefront surface 211 of the second sealing member 21) to allow theattachment of the heat dissipator 4 common to the first electroniccomponent 1 and the second electronic component 2. Thus, the manufactureand maintenance of the device is relatively easy.

Fourth Embodiment

FIG. 15 shows an electronic device A4 according to a fourth embodiment.FIG. 15 is a side view (right side view) of the electronic device A4.

As shown in FIG. 15 , the electronic device A4 differs from theelectronic device A3 in that a gap is provided between the first backsurface of the first main body 10 (back surface 112 of the first sealingmember 11) and the mounting surface 31 (mounting substrate 3).

As with the electronic device A2, the electronic device A4 has a gapbetween the back surface 112 and the mounting surface 31. That is, inthe electronic device A4, the separation distance T1 between the backsurface 112 and the mounting surface 31 is made larger than theseparation distance T1 in the third embodiment. The separation distanceT2 between the back surface 212 and the mounting surface 31 is madelarger than the separation distance T2 in the third embodiment by theamount of the increased separation distance T1. In the presentembodiment again, the separation distance T2 between the back surface212 and the mounting surface 31 is larger than the separation distanceT1 between the back surface 112 and the mounting surface 31.

As with the electronic devices A1-A3, the electronic device A4 includesthe heat dissipator 4 attached to the first electronic component 1 andthe second electronic component 2. Thus, the electronic device A4enhances the heat dissipation from the first electronic component 1 andthe second electronic component 2. The electronic device A4 alsoeliminates a step between the first front surface of the first main body10 (mainly the front surface 111 of the first sealing member 11) and thesecond front surface of the second main body 20 (mainly the frontsurface 211 of the second sealing member 21) to allow the attachment ofthe heat dissipator 4 common to the first electronic component 1 and thesecond electronic component 2. Thus, the manufacture and maintenance ofthe device is relatively easy.

The first and the second embodiments have shown the example in which thefirst terminals 15 (first electronic component 1) and the secondterminals 25 (second electronic component 2) both have theinsertion-mount structure, and the third and the fourth embodiments haveshown the example in which the first terminals 15 (first electroniccomponent 1) and the second terminals 25 (second electronic component 2)both have the surface-mount structure. However, the present disclosureis not limited to these. For example, either the first terminals 15 orthe second terminals 25 may have the insertion-mount structure while theother may have the surface-mount structure.

The first through the fourth embodiments have shown the example in whichthe number of the first semiconductor elements Q1 incorporated in thefirst electronic component 1 is larger than the number of the secondsemiconductor elements Q2 incorporated in the second electroniccomponent 2. However, the present disclosure is not limited to this, andthe number of the first semiconductor elements Q1 may be smaller thanthe number of the second semiconductor elements Q2. Depending on theperformance or type of the elements used as the first semiconductorelements Q1 or the second semiconductor elements Q2, the firstsemiconductor elements Q1 may be larger than the second semiconductorelement Q2. In such a case, the dimension of the first sealing member 11in the z direction may be larger than the dimension of the secondsealing member 21 in the z direction even when the number of the firstsemiconductor elements Q1 is smaller than the number of the secondsemiconductor elements Q2. Even in such a case, a step between the firstfront surface of the first main body 10 (mainly front surface 111) andthe second front surface of the second main body 20 (mainly the frontsurface 211) is eliminated by setting the separation distance T2 betweenthe second sealing member 21 (back surface 212) and the mountingsubstrate 3 (mounting surface 31) in the z direction to be larger thanthe separation distance T1 between the first sealing member 11 (backsurface 112) and the mounting substrate 3 (mounting surface 31) in the zdirection, thus making it possible to attach the heat dissipator 4common to the first electronic component 1 and the second electroniccomponent 2.

The first through the fourth embodiments have shown the example in whichthe electronic device A1-A4 has two electronic components (firstelectronic component 1 and second electronic component 2). However, thepresent disclosure is not limited to these, and the electronic devicemay include three or more electronic components.

The electronic device according to the present disclosure is not limitedto the foregoing embodiments. The specific configuration of each part ofthe electronic device according to the present disclosure may be variedin many ways. For example, the electronic device according to thepresent disclosure include the embodiments described in the followingclauses:

Clause 1.

An electronic device comprising:

a first electronic component including a first main body and a pluralityof first terminals exposed from the first main body;

a second electronic component including a second main body and aplurality of second terminals exposed from the second main body;

a mounting substrate having a mounting surface on which the firstelectronic component and the second electronic component are disposed;and

a heat dissipator having an attaching surface to which the firstelectronic component and the second electronic component are attached,wherein

the first main body and the second main body are disposed between themounting substrate and the heat dissipator in a thickness direction andarranged side by side in a first direction orthogonal to the thicknessdirection,

the mounting surface and the attaching surface face each other in thethickness direction,

the first main body has a first front surface facing the attachingsurface and a first back surface facing the mounting surface,

the second main body has a second front surface facing the attachingsurface and a second back surface facing the mounting surface,

a dimension of the second main body in the thickness direction issmaller than a dimension of the first main body in the thicknessdirection,

the first front surface and the second front surface overlap with eachother as viewed in the first direction, and

a gap is provided between the second back surface and the mountingsurface.

Clause 2.

The electronic device according to clause 1, wherein the first backsurface and the mounting surface are in contact with each other.

Clause 3.

The electronic device according to clause 1, wherein a gap is providedbetween the first back surface and the mounting surface, and

a separation distance between the second back surface and the mountingsurface in the thickness direction is larger than a separation distancebetween the first back surface and the mounting surface in the thicknessdirection.

Clause 4.

The electronic device according to any of clauses 1-3, wherein themounting substrate is formed with a plurality of land patterns on themounting surface, and

the first terminals and the second terminals are each configured as apartially bent surface-mount type and have respective ends bonded to theland patterns.

Clause 5.

The electronic device according to any of clauses 1-3, wherein themounting substrate is formed with a plurality of through-holespenetrating the mounting substrate in the thickness direction, and

the first terminals and the second terminals are each configured as aninsertion-mount type and have respective ends extending in the thicknessdirection and inserted into the through-holes.

Clause 6.

The electronic device according to clause 5, wherein one or more of thesecond terminals include a projection located between the second backsurface and the mounting surface and projecting in a directionorthogonal to the thickness direction.

Clause 7.

The electronic device according to any of clauses 1-6, wherein the firstfront surface and the second front surface are bonded to the attachingsurface of the heat dissipator with an adhesive.

Clause 8.

The electronic device according to any of clauses 1-7, wherein the firstmain body includes a plurality of first semiconductor elements and afirst sealing member covering the first semiconductor elements, and

the plurality of first terminals include a first power terminalelectrically connected to the first semiconductor elements.

Clause 9.

The electronic device according to clause 8, wherein the first main bodyfurther includes a first control element that controls driving of eachof the first semiconductor elements, the first control element beingcovered with the first sealing member, and

the plurality of first terminals include a first control terminalelectrically connected to the first control element.

Clause 10.

The electronic device according to clause 9, wherein the firstelectronic component is a power module.

Clause 11.

The electronic device according to any of clauses 8-10, wherein thefirst main body further includes a first support substrate supporting atleast the first semiconductor elements, and

the first support substrate has a first support surface which faces themounting surface and on which the first semiconductor elements aremounted.

Clause 12.

The electronic device according to clause 11, wherein the first sealingmember has a first sealing surface facing the attaching surface,

the first support substrate further includes a first exposed surfacefacing the attaching surface and exposed from the first sealing surface,and

the first sealing surface and the first exposed surface are flush witheach other and constitute the first front surface.

Clause 13.

The electronic device according to any of clauses 8-12, wherein thesecond main body includes one or more second semiconductor elements thatare less than the first semiconductor elements and a second sealingmember covering the second semiconductor elements, and

the second terminals include a second power terminal electricallyconnected to said one or more second semiconductor elements.

Clause 14.

The electronic device according to clause 13, wherein the second mainbody further includes a second control element that controls driving ofeach of said one or more second semiconductor elements,

the second control element is covered with the second sealing member,and

the plurality of second terminals include a second control terminalelectrically connected to the second control element.

Clause 15.

The electronic device according to clause 14, wherein the secondelectronic component is a power module.

Clause 16.

The electronic device according to any of clauses 13-15, wherein thesecond main body further includes a second support substrate supportingsaid one or more second semiconductor elements, and

the second support substrate has a second support surface which facesthe mounting surface and on which said one or more second semiconductorelements are mounted.

Clause 17.

The electronic device according to clause 16, wherein the second sealingmember has a second sealing surface facing the attaching surface,

the second support substrate further includes a second exposed surfacefacing the attaching surface and exposed from the second sealingsurface, and

the second sealing surface and the second exposed surface are flush witheach other and constitute the second front surface.

LIST OF REFERENCE CHARACTERS

-   A1-A4: Electronic device-   1: First electronic component-   M1: First control element-   Q1: First semiconductor element-   T11, T12: First terminal-   T11 a, T11 b: Input terminal-   T11 c: Output terminal-   T11 d: Detection terminal-   10: First main body-   11: First sealing member-   111: Front surface-   112: Back surface-   113, 114: Side surface-   12: First support substrate-   121: First exposed surface-   122: First support surface-   15: First terminal-   151: First power terminal-   152: First control terminal-   153: First projection-   2: Second electronic component-   M2: Second control element-   Q2: Second semiconductor element-   T21, T22: Second terminal-   T21 a, T21 b: Input terminal-   T21 c: Output terminal-   T21 d: Detection terminal-   20: Second main body-   21: Second sealing member-   22: Second support substrate-   25: Second terminal-   211: Front surface-   212: Back surface-   213: Side surface-   214: Side surface-   221: Second exposed surface-   222: Second support surface-   251: Second power terminal-   252: Second control terminal-   253: Second projection-   3: Mounting substrate-   31: Mounting surface-   33: Through-hole-   34: Land pattern-   4: Heat dissipator-   41: Attaching surface-   5: Conductive bonding material

1. An electronic device comprising: a first electronic componentincluding a first main body and a plurality of first terminals exposedfrom the first main body; a second electronic component including asecond main body and a plurality of second terminals exposed from thesecond main body; a mounting substrate having a mounting surface onwhich the first electronic component and the second electronic componentare disposed; and a heat dissipator having an attaching surface to whichthe first electronic component and the second electronic component areattached, wherein the first main body and the second main body aredisposed between the mounting substrate and the heat dissipator in athickness direction and arranged side by side in a first directionorthogonal to the thickness direction, the mounting surface and theattaching surface face each other in the thickness direction, the firstmain body has a first front surface facing the attaching surface and afirst back surface facing the mounting surface, the second main body hasa second front surface facing the attaching surface and a second backsurface facing the mounting surface, a dimension of the second main bodyin the thickness direction is smaller than a dimension of the first mainbody in the thickness direction, the first front surface and the secondfront surface overlap with each other as viewed in the first direction,and a gap is provided between the second back surface and the mountingsurface.
 2. The electronic device according to claim 1, wherein thefirst back surface and the mounting surface are in contact with eachother.
 3. The electronic device according to claim 1, wherein a gap isprovided between the first back surface and the mounting surface, and aseparation distance between the second back surface and the mountingsurface in the thickness direction is larger than a separation distancebetween the first back surface and the mounting surface in the thicknessdirection.
 4. The electronic device according to claim 1, wherein themounting substrate is formed with a plurality of land patterns on themounting surface, and the first terminals and the second terminals areeach configured as a partially bent surface-mount type and haverespective ends bonded to the land patterns.
 5. The electronic deviceaccording to claim 1, wherein the mounting substrate is formed with aplurality of through-holes penetrating the mounting substrate in thethickness direction, and the first terminals and the second terminalsare each configured as an insertion-mount type and have respective endsextending in the thickness direction and inserted into thethrough-holes.
 6. The electronic device according to claim 5, whereinone or more of the second terminals include a projection located betweenthe second back surface and the mounting surface and projecting in adirection orthogonal to the thickness direction.
 7. The electronicdevice according to claim 1, wherein the first front surface and thesecond front surface are bonded to the attaching surface of the heatdissipator with an adhesive.
 8. The electronic device according to claim1, wherein the first main body includes a plurality of firstsemiconductor elements and a first sealing member covering the firstsemiconductor elements, and the plurality of first terminals include afirst power terminal electrically connected to the first semiconductorelements.
 9. The electronic device according to claim 8, wherein thefirst main body further includes a first control element that controlsdriving of each of the first semiconductor elements, the first controlelement being covered with the first sealing member, and the pluralityof first terminals include a first control terminal electricallyconnected to the first control element.
 10. The electronic deviceaccording to claim 9, wherein the first electronic component is a powermodule.
 11. The electronic device according to any of claims 8 10 claim8, wherein the first main body further includes a first supportsubstrate supporting at least the first semiconductor elements, and thefirst support substrate has a first support surface which faces themounting surface and on which the first semiconductor elements aremounted.
 12. The electronic device according to claim 11, wherein thefirst sealing member has a first sealing surface facing the attachingsurface, the first support substrate further includes a first exposedsurface facing the attaching surface and exposed from the first sealingsurface, and the first sealing surface and the first exposed surface areflush with each other and constitute the first front surface.
 13. Theelectronic device according to claim 8, wherein the second main bodyincludes one or more second semiconductor elements that are less thanthe first semiconductor elements and a second sealing member coveringthe second semiconductor elements, and the second terminals include asecond power terminal electrically connected to said one or more secondsemiconductor elements.
 14. The electronic device according to claim 13,wherein the second main body further includes a second control elementthat controls driving of each of said one or more second semiconductorelements, the second control element is covered with the second sealingmember, and the plurality of second terminals include a second controlterminal electrically connected to the second control element.
 15. Theelectronic device according to claim 14, wherein the second electroniccomponent is a power module.
 16. The electronic device according toclaim 13, wherein the second main body further includes a second supportsubstrate supporting said one or more second semiconductor elements, andthe second support substrate has a second support surface which facesthe mounting surface and on which said one or more second semiconductorelements are mounted.
 17. The electronic device according to claim 16,wherein the second sealing member has a second sealing surface facingthe attaching surface, the second support substrate further includes asecond exposed surface facing the attaching surface and exposed from thesecond sealing surface, and the second sealing surface and the secondexposed surface are flush with each other and constitute the secondfront surface.